IC Packages

Note: Each family has many variants (body sizes, lead‑pitches, thermal options, ceramic vs. plastic). Always consult the specific device’s datasheet for exact package dimensions, pin‑outs and thermal/PCB‑layout recommendations.

Image	Package	Full Name & Style	Mounting	Typical Pin‑Count Range	Notes
	DIP	Dual Inline Package	Through‑hole	4 – 64	Legacy logic, microcontrollers, prototyping
	SIP	Single Inline Package	Through‑hole	4 – 16	Resistor/diode networks, simple modules
	PGA	Pin Grid Array	Through‑hole	64 – 500	CPUs, high‑end DSPs, socketed devices
	ZIP	Zig‑Zag Inline Package	Through‑hole	8 – 20	Older memory and logic modules (now rare)
	PLCC	Plastic Leaded Chip Carrier	SMT	20 – 84	PLDs, FPGAs, EEPROMs
	SOJ	Small Outline J‑lead	SMT	24 – 52	DRAM chips, some logic ICs
	TSOP	Thin Small Outline Package	SMT	8 – 60	Flash memory (NAND/NOR), slim modules
	TSSOP	Thin Shrink Small Outline Package	SMT	8 – 80	ADCs, interface ICs, where board space is tight
	QFP	Quad Flat Package	SMT	32 – 304	Microcontrollers, DSPs; variants include LQFP, HTQFP…
	TQFP	Thin Quad Flat Pack (gull‑wing leads on four sides)	SMT	32 – 176 (up to ≈208)	Low‑profile QFP; lead pitches usually 0.5 mm or 0.8 mm.
	VQFN	Very thin Quad Flat No‑leads (exposed pad underside)	SMT	8 - 100	No gull‑wing leads—contacts are pads on package edges; Power ICs, sensors; exposed thermal pad underside
	QFN / DFN	Quad/Dual Flat No‑lead	SMT	8 – 100	Same as VQFN; some call smaller DFN
	MLF / LFCSP	MicroLeadFrame / LeadFrame CSP	SMT	8 – 128	Power management, interface ICs; exposed pad
	CSP / WLCSP	Chip‑Scale Package / Wafer‑Level CSP	SMT	4 – 256	Mobile SoCs, RF chips; minimal package size
	BGA	Ball Grid Array	SMT	36 – 2600+	High‑pin CPUs, FPGAs, GPUs—excellent thermal & signal
	LGA	Land Grid Array	SMT	60 – 1700	Some server CPUs; flat lands instead of balls
	SOIC	Small Outline IC (gull‑wing dual‑in‑line)	SMT	8 - 28	Medium‑density logic; Standard lead pitch 1.27 mm; “wide” SOIC bodies support up to 28 pins.
	SSOP	Shrink Small Outline Package (narrow SOIC)	SMT	8 – 56	ASICs, memories; Lead pitch typically 0.5 mm or 0.635 mm; body narrower than SOIC.
	SOT‑23	Small Outline Transistor	SMT	3 – 6	Discrete transistors, small regulators
	SOT‑223	Small Outline Transistor (power variant)	SMT	4	Low‑power regulators, amplifiers

Brief Descriptions

DIP

Two parallel rows of straight leads. Common on microcontrollers, legacy logic, prototyping.

SIP

One row of pins. Used for resistor/diode networks, modules.

PGA

Grid of pins on bottom. Often CPUs (Socket‑type) and high‑end DSPs.

ZIP

Pins staggered in a zig‑zag down one side. Less common today.

PLCC

Square body with J‑leads. Was popular for PLDs, FPGAs, EEPROMs.

SOJ

Like SOIC but with J‑shaped leads. Used on DRAM and some logic.

TSOP

Very low‑profile SOP (pitch ≈ 1.0 mm). Widely used for flash memory.

TSSOP

Narrower, finer‑pitch SOP (pitch 0.5–0.65 mm). Common for ADCs, interfaces.

QFP

Gull‑wing leads on four sides. Variants: LQFP, HTQFP, etc.

TQFP

A thinner variant of the classic QFP. Leads extend from all four sides in a gull‑wing style. Widely used for microcontrollers and DSPs where moderate to high pin counts (32–176) are needed in a slim form.

VQFN

A low‑profile “no‑leads” package: metal pads sit flush on the PCB; an exposed pad under the package provides heat‑dissipation. Common for RF, power, and high‑density logic ICs. Starts as low as 8 pins and goes up to around 100 pins.

QFN / DFN

No gull‑wings—contacts are pads. Includes DFN, SON. Used for power‑ICs, sensors.

MLF / LFCSP

A QFN‑style leadframe with exposed pad. Power management, interface ICs.

CSP / WLCSP

Bare‑die sized package with solder bumps. Mobile SoCs, RF chips.

BGA

Array of solder balls underneath. High‑pin CPUs, FPGAs, GPUs.

LGA

Array of flat lands (no balls). Seen on some server CPUs.

SOIC

A very common DIP‑replacement: gull‑wing leads on two sides. Pin counts start at 8 and usually top out at 28 for the “wide” body; it’s a go‑to for medium‑density logic.

SSOP

Essentially a “shrink” SOIC with finer pitch leads (0.5 – 0.635 mm), allowing more pins (up to 56 in some families) in a narrower footprint. Popular for ASICs and memory devices where board‑space is at a premium.

SOT‑23

Tiny 3‑pin (or 5‑pin) package. Common discrete transistors/regulators.

SOT‑223

4‑lead power package. Low‑power regulators, small amplifiers.